Würth Elektronik has restructured its SMT spacer portfolio to use lead free alloys, aligning with the upcoming expiry of the RoHS exemption at the end of June 2027. The update is intended to provide long term compliance security for electronics manufacturers designing new assemblies.
Under the European RoHS Directive, lead free refers to a maximum lead content of 0.1 percent. The revised spacers comply with Directives 2011/65/EU and 2015/863/EU.
The transition to lead free alloys covers several SMT spacer variants:
According to the company, the updated components have undergone qualification testing and can be processed using standard lead free solder pastes.
For OEMs and Tier suppliers, early adoption reduces redesign risk, recertification effort and compliance exposure once the exemption period ends.
In parallel with the material update, Würth Elektronik has introduced additional SMT assembly aid variants.
Previously, spacers were available with a polyimide film including a removal tab, designation R. Two further options are now available:
The RX variant targets efficiency gains in automated assembly environments.
The spacers support multi level PCB constructions and can be used for:
A tin surface finish enables multiple reflow soldering cycles without discoloration, blistering or cracking. Proper coordination of solder pad geometry, paste selection and surface alloy thickness ensures stable mechanical joints with high holding forces and torque resistance.
For bus and commercial vehicle electronics, compliance and mechanical durability are critical. Control units, ADAS modules, battery management systems and HMI boards must meet both regulatory and vibration resistance requirements.
The transition to lead free SMT spacers ahead of RoHS 2027 provides planning security for new platform developments and long lifecycle vehicle programs.
