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TDK Corporation has expanded its micro point-of-load (POL) power module portfolio with the introduction of the FS3303, an ultra-compact non-isolated DC-DC power module designed for AI edge systems, optical networking equipment and space-constrained embedded applications.
The FS3303 delivers up to 3A output current within a 2.5 × 2.5 mm footprint and a height of 1.2 mm. According to TDK, the module achieves peak efficiency levels of approximately 95% while operating at ambient temperatures up to +90 °C, with operation up to +125 °C possible under derating conditions.
The module supports input voltages ranging from 2.7V to 6V and output voltages between 0.4V and 3.3V, targeting low-voltage processing environments including ASICs, SoCs, DSPs and AI chipsets that require high transient response and voltage regulation stability.
TDK stated that the FS3303 integrates the controller, driver, MOSFETs and power inductor using the company’s proprietary 3D chip-embedded packaging technology. This architecture reduces the need for external components while improving board space utilization in compact electronic systems.
The company also confirmed that the new micro POL portfolio will scale from 3A to 80A output configurations across low-voltage rails from 0.3V to 3.3V. The platform is intended to support high-bandwidth optical modules and AI accelerator systems, including next-generation optical networking equipment operating at data rates up to 1.6 Tbit/s.
TDK noted that the modules are designed for applications requiring compact power management architectures, including edge AI modules, embedded computing systems and high-density communication hardware.
