Event logo
  • Products
  • Sellers
  • People
  • News
  • Sessions
  • Show more

EN

​
Technology Exhibition (Pay)

Marketplace

BuyersSellersProducts

People

BuyersSellersBW Plaza Team

Knowledge

NewsEngageMedia

plaza@busworld.org

Moorseelsesteenweg 2, 8800 Roeselare, Belgium

Copyright © 2024. Busworld. All rights reserved.

  1. Home

  2. /
  3. News

  4. /
  5. Hinduja Tech Acquires TECOSIM, Expanding Body Engineering and Virtual Validation Capabilities for Bus OEMs

Hinduja Tech Acquires TECOSIM, Expanding Body Engineering and Virtual Validation Capabilities for Bus OEMs

Hinduja Tech Acquires TECOSIM, Expanding Body Engineering and Virtual Validation Capabilities for Bus OEMs

January 14, 2026By Hinduja Tech
Share this article

Hinduja Tech has completed the acquisition of European engineering services provider TECOSIM Group, strengthening its capabilities in vehicle body engineering and virtual validation. The move expands Hinduja Tech’s engineering footprint in Europe and reinforces its positioning in advanced vehicle development and systems integration.

TECOSIM brings established expertise in virtual validation, structural simulation, and body engineering, disciplines that are increasingly critical in bus platform development. Digital validation tools are now central to reducing development cycles, optimizing structural performance, and ensuring compliance with safety and durability requirements before physical prototyping.

For bus OEMs and bodybuilders, the combined capabilities enable deeper front loading of engineering work across body structures, chassis integration, and lightweight design. Virtual validation supports earlier detection of structural weaknesses, improved crash and fatigue performance, and more efficient adaptation of platforms to different regulatory and operating environments.

The acquisition also strengthens cross regional engineering delivery. With teams across Europe and Asia, Hinduja Tech can support global bus programs requiring localized engineering, homologation support, and scalable development resources. As bus platforms become more electrified and modular, access to integrated body engineering and digital validation capabilities is becoming a key supplier selection factor.

Recommended News for You

From IMEC 1.0 to 2.2: The Evolution of Intelligent Cockpit Design
January 14, 2026Shanghai TRION Industrial Co.,Ltd.
Cooling Fans in Electric Buses, Specifying Airflow, Control Logic, and Durability for Battery and Power Electronics Thermal Management
January 14, 2026Changzhou Sunlight Electrical Appliance CO.,Ltd
Gurit Launches StrucPro Epoxy Systems for High-Performance Composite Structures in Bus Manufacturing
January 14, 2026Gurit Wind Private Limited
EU–Mercosur Free Trade Agreement Opens New Opportunities for Bus Components, Manufacturing, and Cross-Regional Supply Chains
January 14, 2026Helpdesk Busworld Plaza
HÜBNER produced 1,085 Double Ramp sets in 2025
January 8, 2026Jos Haas